Method for Attaching Fluidic Interconnects using Resistively Heated Gold
نویسنده
چکیده
Two methods of attaching fluidic interconnects are presented. By using gold to gold fusion bonding and copper to gold fusion bonding, micro-scale tubes are attached to a MUMPS fabricated fluidic channel. The fusion bonding is done by resistively heating a gold layer on top of the poly 2 layer, so that the gold melts. A range of different heater geometries is presented. The tensile and shear strengths of the resultant bonds are then tested.
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